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Call for Fellow Nominations

On or about 15 May, 2008, the nomination period will open for the IEEE Fellow class of 2010.  The rank of IEEE Fellow is the institute’s highest member grade, bestowed on an IEEE Senior Member who has had an extraordinary record of accomplishments in any of the IEEE fields of interest.  The deadline for nominations is 1 March 2009.

Senior Members can be nominated in one of four categories: application engineer/practitioner, research engineer/scientist, educator, or technical leader.

The Fellows Web pages contain information regarding the history of the IEEE Fellow program, the steps to becoming a Fellow, lists of Fellows who are eligible to be references, frequently asked questions and more.  After the nomination period opens, the web pages will offer a Fellow Nomination Kit, downloadable nominations forms and the ability to complete and submit nomination forms online.

You may visit the Fellows web pages at http://www.ieee.org/fellows.

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Iowa School Wins IEEE-USA National Engineering Award

Harding Middle School, assisted by IEEE-CR member Gary Bishop, triumphs in Future Cities competition

IEEE-USA 2006 ANNUAL REPORT NOW AVAILABLE ONLINE

In 2006, IEEE-USA 2006 President Ralph W. Wyndrum, Jr., in collaboration with IEEE-USA 2007 President-Elect John Meredith, focused on four primary areas of IEEE mission.

The Institute Online

In This Issue: 1. Indian Groups Know Secret of Recruiting Members: Fun 2. For Handling the Master Brand, Follow the Rules 3. Employment Navigator Adds Features, Drops Subscription Fee 4. History Milestone Recognizes Spanish Engineer''''s Remote Control 5. IEEE GOLD Online Seminar Focuses on Career Decisions 6. Oceans07 Coming in June 7. Two Members Write the Book on Virtual Teams 8. The Institute Wants to Hear About Your Career Fair 9. The Book on Simple Wireless Devices 10. IEEE Signs Agreement to Preserve IEEE Xplore Content 11. IEEE Spectrum Radio Discusses Top 10 Tech Cars 12. Do-it-Yourself Contest Winner to Present Project at Maker Faire

IEEE Section May Meeting

Biomicrosystems By Dr. William Wang